Tsinghua Unigroup has received a staggering CNY150 billion (US$21.8 billion) infusion of liquidity from government-linked China Development Bank and a national integrated circuit investment, in order to drum up a larger market share in the semiconductor industry.
Tsinghua released a statement with details – China Development Bank will be sinking in CNY100 billion (US$14.5 billion) over the course of five years. On the other hand, China’s Integrated Circuit Industry Investment Fund will invest up to CNY50 billion (US$7.2 billion), about a third of its CNY140 billion portion.
It has been on a bit of a buying spree, as of late, with large investments being made here and there—notably, Tsinghua is investing US$30 billion into a Nanjing foundry to produce NAND flash and DRAM chips. The reveal of the Nanjing facility follows soon after plans for a facility in Wuhan (estimated to cost around US$24 billion) were announced.
China is pouring more money into chasing its semiconductor ambitions and hopes to achieve pole position as a manufacturer by 2030. The state-backed Tsinghua Unigroup, which has been building up the country’s chip-industry infrastructure, received a CNY150 billion (US$22 billion) in financing on Tuesday.
Résumé en français
Tsinghua Unigroup va recevoir 14,5 milliards de dollars, en cinq ans, de la China Development Bank et 7,2 milliards de dollars du China’s Integrated Circuit Industry Investment Fund.
L’objectif est de prendre la première place mondiale dans la production des semi-conducteurs d’ici 2030.
Illustration en vidéo
Source de l’information
Tech Wire Asia
Article: China’s Tsinghua Unigroup gets $22b to lead semiconductor growth.
Sujet et source de l’image
Sujet de l’image: Semi-conducteurs.
Source de l’image : Wikimedia Commons.